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Samsung EMMC              
               
  料号  版本 容量 工作电压 接口 封装尺寸 工作温度 生产状态
 KLM8G1GESD-B03P  eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production
 KLM8G1GESD-B03Q  eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production
 KLMAG2GESD-B03P  eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production
 KLMAG2GESD-B03Q  eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production
 KLMBG4GESD-B03P  eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production
 KLMBG4GESD-B03Q  eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production
 KLMCG8GESD-B03P  eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production
 KLMCG8GESD-B03Q  eMMC 5.0 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production

 
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