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| 料号 |
版本 |
容量 |
工作电压 |
接口 |
封装尺寸 |
工作温度 |
生产状态 |
| KLM8G1GESD-B03P |
eMMC 5.0 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
Mass Production |
| KLM8G1GESD-B03Q |
eMMC 5.0 |
8 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
Mass Production |
| KLMAG2GESD-B03P |
eMMC 5.0 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 85 °C |
Mass Production |
| KLMAG2GESD-B03Q |
eMMC 5.0 |
16 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 0.8 mm |
-40 ~ 105 °C |
Mass Production |
| KLMBG4GESD-B03P |
eMMC 5.0 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
Mass Production |
| KLMBG4GESD-B03Q |
eMMC 5.0 |
32 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 105 °C |
Mass Production |
| KLMCG8GESD-B03P |
eMMC 5.0 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 85 °C |
Mass Production |
| KLMCG8GESD-B03Q |
eMMC 5.0 |
64 GB |
1.8 / 3.3 V |
HS400 |
11.5 x 13 x 1.0 mm |
-40 ~ 105 °C |
Mass Production |
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